The manufacturing operations at CTT are highly integrated into all facets of the production build. CTT maintains manufacturing operations within its San Jose, California headquarters. These offices are staffed with engineering and materials support personnel that manage the day-to-day activities. Having built hundreds of thousands of products with power levels that range from a few milliwatts to 1 kW, CTT has become a leader in solid-state microwave amplification. CTT’s U.S.-based, 32,200 square-foot manufacturing facility offers a complete solution in the production of microwave integrated circuits. Moreover, CTT’s facility was specifically designed to accommodate the unique requirements of hybrid microwave integrated circuit manufacturing conforming to MIL-PRF-38534. Another important factor differentiating the CTT facility from other manufacturers is the availability of comprehensive microwave frequency test capabilities. This offers the customer to choose from either “standard” testing procedures or to customize testing to meet stringent system requirements. CTT’s microwave testing utilizes the latest in network analysis tools. One of the primary strengths of CTT’s integrated circuit manufacturing is the ability to mix and match technologies to best meet the requirements of a particular application.


CTT is committed to provide the highest level of reliability in its products. This is demonstrated by the extremely low number of repairs that the company receives. Every product that CTT delivers strictly adheres to active de-rating criteria, thermal design consideration, and proven manufacturing techniques established by CTT’s engineering and quality departments as well as those required by it’s suppliers. During development phase, manufacturing operations perform product planning that includes design verification, supplier selection, manpower analysis, equipment needs, and master scheduling. Once a product is committed to the production department, production control monitors material suppliers and work-in-process to ensure that any issues affecting the delivery commitments are addressed and corrected immediately. Automation is used extensively all through the manufacturing process wherever possible.


Contains Class 10,000 Clean Rooms, and houses a computer controlled, fully automated, robotic manufacturing operation comprising of:

Multiple Pick-and-Place Machines Capabilities Accommodate:
• Hybrid Microwave ICs
• Surface-Mount Components
• Leaded Components

The Latest Automated Wire Bond Machines Programmed for:
• 0.5 to 0.7 mil Wire Bonding
• 2 to 25 mil Ribbon Bonding

Programmable Epoxy Dispensers
• Conductive Epoxy Attachment

Component Mounting
• Batch and Continuous Flow
• Eutectic Component Attach
• Lead-Free Solder Available

Inventory Control

Full Nitrogen Containment (to Preserve Solderability and Bondability)
Project Stock Accounting
Component and Assembly Lot Number Control
Bonded Customer Storage

Material Management

Project Availability and Yield Analysis
Supplier Delivery, Pricing and Cost Performance Auditing
Standalone Materials Procurement Group
Project Target Goals and Budget Management