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Contract Manufacturing Services
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A Proud History
Since 1981 CTT has been supplying customers worldwide with power amplifiers,
frequency converters, frequency multipliers, transmitters, transceivers, and
receivers within the frequency spectrum of 300 MHz to 45 GHz. CTT's products
are designed to provide the best price versus performance combination for each
customer, whether the end use is military, industrial or commercial.
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Experience that Counts
CTT is an experienced and proven supplier serving the communications and defense
electronics markets. The requirements for the majority of the products supplied
are in accordance with customer provided specifications requiring the company
to develop designs, processes and procedures that ensure versatility while
maintaining
low cost and high reliability.
Having built thousands of products with power levels that range from a few watts
to 1 kW, CTT has become a leader in solid-state microwave amplification. This
experience is now available to companies looking for a proven, reliable supplier
of multi-function microwave assemblies.
Whether the need for such service arises from either economic or capacity driven
concerns, CTT's new U.S. based, 45,000 square-foot manufacturing facility offers
a complete solution that is a proven domestic alternative to "off-shore" contract
manufacturers of microwave integrated circuits.
Moreover, CTT's facility was specifically designed to accommodate the unique
requirements of hybrid microwave integrated circuit manufacturing conforming
to MIL-PRF-38534C.
Another important factor differentiating the CTT facility from other contract
manufacturers is the availability of comprehensive microwave frequency test capabilities.
This offers the customer to choose from either "standard" testing procedures
or to customize testing to meet stringent system requirements.
CTT's microwave testing utilizes the latest in network analysis tools. One of
the primary strengths of CTT's integrated circuit manufacturing is the ability
to mix and match technologies to best meet the requirements of a particular application.
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Automated and Optimized Manufacturing
CTT has, over the past two decades, developed an automated and optimized thin-film
hybrid manufacturing process especially suited to the production of microwave
integrated circuits using chip and wire-bond techniques.
The selection of appropriate equipment relies on the expertise of CTT's engineers
and technicians and their knowledge of the latest generations of placement systems
necessary to handle the diverse nature of microwave components - to stock them
for assembly, to visually place them very accurately and to accommodate the fine
pitches of microwave devices.
CTT has selected and acquired the latest equipment that best fits the special
requirements of circuit assembly to perform at microwave frequencies.
Considerations unique to the microwave technology that have been addressed include:
• Component Placement Speed and Accuracy
• Accurate Adhesive Dispensing
• Automatic Substrate and Component Handling
• Off-Line and Real-Time Programming
• Component Verification
• Set-Up Time
• Shape and Number of Components to be Handled
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Service You Can Count On
CTT's separate "CONTRACT" cost centers offer high quality, low
cost, volume production and on-time delivery. Contact us today and find out how
our high quality products and service can support your success. Modern 45,000
Square-Foot Facility contains 12,000 Square-Feet of Class 1,000 and Class 10,000
Clean Rooms, and houses a computer-controlled, fully automated, robotic manufacturing
operation
comprising of:
o Multiple Pick-and-Place Machines whose Capabilities Accommodate
- Hybrid Microwave ICs
- Surface-Mount Components
- Leaded Components
o The Latest Automated Wire Bond Machines Programmed for
- 0.5 to 0.7 mm Wire Bonding
- 2 to 25 mm Ribbon Bonding
o Programmable Epoxy Dispensers
- Conductive Epoxy Attachment
o Component Mounting
- Batch and Continuous Flow
- Eutectic Component Attach
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Inventory Control
o Full Nitrogen Containment (to Preserve Solderability and Bondability)
o Project Stock Accounting
o Component and Assembly Lot Number Control
o Bonded Customer Storage
Material Management
o Project Availability and Yield Analysis
o Supplier Delivery, Pricing and Cost Performance Auditing
o Standalone Materials Procurement Group
o Project Target Goals and Budget Management
Product Test, Evaluation and Analysis
o Solderability Test and Analysis
o Optical Microscopy
o Electron Scanning Microscopy (10X to 1500X)
o Mechanical Tolerance and Testing
o Thermal and Imaging Analysis
o Surface and Wire Insulation Resistance
o Plating Thickness Measurement
o EMI Testing
o Equipment Calibration Traceability to NIST
o Available Environmental Testing to: MIL-STD-810 / MIL-STD-202 / MIL-E-5400
o Quality System: ISO 9001/2000
o Hybrid Construction Conforms to MIL-PRF-38534C
Production Testing
o Analog and DIgital Control Electronic Test
o Frequencies to 45 GHz
o Microwave Power to 100 Watts
All Major Input Formats
o Schematic Capture and PCB Layout
o Auto-CAD
o INVENTOR
o DXF Files
o PDF
o Blue Print
o Many Others
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©2006 CTT, Inc. All Rights Reserved
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